Feature

• The HPA series is a three-axis controlled wafer edge finder. The entire series uses micro single-axis robot modules to achieve the advantages of high speed, high precision, high rigidity, high efficiency and small size.
• The embedded controller design (All-in-one design) eliminates the need for additional controller and wiring space. Under the same specifications, the product size is the smallest in the industry.
• Equipped with an intelligent light-transmitting laser sensor, it can support the contour detection function of transparent, translucent and opaque objects, and is suitable for wafers, glass, etc. with a diameter of 100mm~300mm.
• The product cleanliness level is ISO Class 3 (Class 1), and its application scope includes semiconductor, optoelectronics and other industries.

APPLICATION

• It is suitable for calibration and alignment in the semiconductor industry (wafer), LED industry (sapphire substrate), optoelectronic industry (glass), etc.